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INTEGRATED CIRCUITS
DATA SHEET
TDA1516BQ 24 W BTL or 2 x 12 watt stereo car radio power amplifier
Product specification File under Integrated Circuits, IC01 July 1994
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 watt stereo car radio power amplifier
GENERAL DESCRIPTION
TDA1516BQ
The TDA 1516BQ is an integrated class-B output amplifier in a 13-lead single-in-line (SlL) plastic power package. The device is primarily developed for car radio applications. FEATURES * Requires very few external components * Flexibility in use - stereo as well as mono BTL * High output power (without bootstrap) * Low offset voltage at output (important for BTL) * Fixed gain * Good ripple rejection * Mute/stand-by switch * Load dump protection * A.C. and d.c. short-circuit-safe to ground and VP QUICK REFERENCE DATA PARAMETER Supply voltage range operating non-operating load dump protected Repetitive peak output current Total quiescent current Stand-by current Switch-on current Input impedance BTL stereo Stereo application Output power Channel separation Noise output voltage BTL application Output power Supply voltage ripple rejection D.C. output offset voltage THD = 10%; 4 RS = 0 ; f = 100 Hz to 10 kHz RR |VO| 48 - - - - 100 dB mV Po - 22 - W THD = 10%; 4 THD = 10%; 2 Po Po Vno(rms) - - 40 - 6 11 - 50 - - - - W W dB V |ZI| |ZI| 25 50 - - - - k k IORM Itot Isb Isw - - - - - 30 0,1 - 4 - 100 40 A mA A A VP VP VP 6,0 - - 14,4 - - 18,0 30,0 45,0 V V V CONDITIONS SYMBOL MIN. TYP. MAX. UNIT * Thermally protected * Reverse polarity safe * Capability to handle high energy on outputs (VP = 0 V) * No switch-on/switch-off plop * Flexible leads * Low thermal resistance * Identical inputs (inverting and non-inverting) * Compatible with TDA1518Q (except gain)
July 1994
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Philips Semiconductors
Product specification
24 W BTL or 2 x 12 watt stereo car radio power amplifier
PACKAGE OUTLINE 13-lead SIL-bent-to-DIL; plastic power (SOT141); SOT141-6; 1996 July 24.
TDA1516BQ
Fig.1 Block diagram.
July 1994
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Philips Semiconductors
Product specification
24 W BTL or 2 x 12 watt stereo car radio power amplifier
PINNING 1 2 3 4 5 6 7 -INV1 non-inverting input 1 INV Vref OUT1 BS1 inverting input reference voltage output 1 bootstrap 1 GND1 ground (signal) 8 9 10 11 12 13 BS2 OUT2 VP M/SS RR bootstrap 2 output 2 supply voltage mute/stand-by switch
TDA1516BQ
supply voltage ripple rejection
-INV2 non-inverting input 2
GND2 ground (substrate)
FUNCTIONAL DESCRIPTION The TDA1516BQ contains two identical amplifiers with differential input stages. This device can be used for stereo or bridge applications. The gain of each amplifier is fixed at 20 dB. A special feature of this device is the mute/stand-by switch which has the following features: * low stand-by current (< 100 A) * low mute/stand-by switching current (low cost supply switch) * mute condition. RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) PARAMETER Supply voltage operating non-operating load dump protected A.C. and d.c. short-circuitsafe voltage Reverse polarity Energy handling capability at outputs Non-repetitive peak output current Repetitive peak output current Total power dissipation Crystal temperature Storage temperature range see Fig.2 IORM Ptot Tc Tstg - - - -55 4 25 150 + 150 A W C C IOSM - 6 A VP = 0 V - 200 mJ VPSC VPR - - 18 6 V V during 50 ms; tr 2,5 ms VP - 45 V VP VP - - 18 30 V V CONDITIONS SYMBOL MIN. MAX. UNIT
July 1994
4
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 watt stereo car radio power amplifier
TDA1516BQ
Fig.2 Power derating curve.
July 1994
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Philips Semiconductors
Product specification
24 W BTL or 2 x 12 watt stereo car radio power amplifier
D.C. CHARACTERISTICS (note 1) VP = 14,4 V; Tamb = 25 C; unless otherwise specified PARAMETER Supply Supply voltage range Quiescent current D.C. output voltage at approximately VP/2 D.C. output offset voltage Mute/stand-by switch Switch-on voltage level Mute condition Output signal in mute position D.C. output offset voltage Stand-by condition D.C. current in stand-by condition Switch-on current Isb Isw - - - 12 |V5-9| Vsb - 0 - - VI = 1 V (max.); f = 20 Hz to 15 kHz VO - - VON Vmute 8,5 3,0 - - |V5-9| - - note 3 VO - 6,8 note 2 VP IP 6,0 - 14,4 40 CONDITIONS SYMBOL MIN. TYP.
TDA1516BQ
MAX.
UNIT
18,0 80 - 100 - 6,4
V mA V mV
V V
2 100 2
mV mV V A A
100 40
July 1994
6
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 watt stereo car radio power amplifier
A.C. CHARACTERISTICS VP = 14,4 V; RL = 4 ; f = 1 kHz; Tamb = 25 C; unless otherwise specified PARAMETER Stereo application Output power CONDITIONS note 1 note 4; THD = 0,5% THD = 10% notes 4 and 5; THD = 10% Output power at RL = 2 note 4; THD = 0,5% THD = 10% notes 4 and 5; THD = 10% Low frequency roll-off High frequency roll-off Closed loop voltage gain Supply voltage ripple rejection: ON mute stand-by Input impedance Noise output voltage: ON ON mute Channel separation Channel balance note 8; RS = 0 RS = 10 k note 9 RS = 10 k Vno(rms) Vno(rms) Vno(rms) Gv - - - 40 - 50 70 50 - - note 7 RR RR RR |ZI| 48 48 80 50 - - - 60 note 6; -3 dB -1 dB fL fH Gv - 20 19 45 - 20 Po 10,5 12,0 Po Po 7.5 10 8,5 11 Po 6 7 Po Po 4 5,5 5 6,0 SYMBOL MIN. TYP.
TDA1516BQ
MAX.
UNIT
- - - - - - - - 21
W W W W W W Hz kHz dB
- - - 75 - 100 - - 1
dB dB dB k V V V dB dB
July 1994
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Philips Semiconductors
Product specification
24 W BTL or 2 x 12 watt stereo car radio power amplifier
PARAMETER BTL application Output power CONDITIONS note 10 THD = 0,5% THD = 10% note 5; THD = 10% Output power at VP = 13,2 V THD = 0,5% THD = 10% note 5; THD = 10% Power bandwidth THD = 0,5% Po = 15 W Low frequency roll-off High frequency roll-off Closed loop voltage gain Supply voltage ripple rejection: ON mute stand-by Input impedance Noise output voltage ON ON mute Notes to the characteristics 1. All characteristics, for stereo application are measured using the circuit shown in Fig.3. 2. The circuit is d.c. adjusted at VP = 6 V to 18 V and a.c. operating at VP = 8,5 to 18 V. 3. At 18 V < VP < 30 V the d.c. output voltage VP/2. 4. Output power is measured directly at the output pins of the IC. note 8; RS = 0 RS = 10 k note 9 Vno(rms) Vno(rms) Vno(rms) - - - 70 100 60 note 7 RR RR RR |ZI| 48 48 80 25 - - - 30 note 6; -3 dB -1 dB fL fH Gv - 20 25 25 - 26 Bw - 20 to 15 000 Po Po Po - - - 13,5 17 19 Po Po Po 15,5 20 21 17,0 22 24 SYMBOL MIN. TYP.
TDA1516BQ
MAX. - - - - - - -
UNIT W W W W W W Hz
- - 27
Hz kHz dB
- - - 38 - 200 -
dB dB dB k V V V
5. With bootstrap and a 100 k resistor from pin 12 to the positive supply voltage (VP), value of bootstrap capacitor is 47 F. 6. Frequency response externally fixed. 7. Ripple rejection measured at the output with a source impedance of 0 (maximum ripple amplitude of 2 V) and a frequency between 1 kHz and 10 kHz. 8. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz. 9. Noise output voltage independent of RS (VI = 0 V). 10. All characteristics, for BTL application are measured using the circuit shown in Fig.4.
July 1994
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Philips Semiconductors
Product specification
24 W BTL or 2 x 12 watt stereo car radio power amplifier
APPLICATION INFORMATION
TDA1516BQ
Fig.3 Stereo application circuit diagram.
Fig.4 BTL application circuit diagram (without bootstrapping).
July 1994
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Philips Semiconductors
Product specification
24 W BTL or 2 x 12 watt stereo car radio power amplifier
PACKAGE OUTLINE DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
TDA1516BQ
SOT141-6
non-concave x D Dh
Eh
view B: mounting base side
d
A2
B j E A
L3
L
Q c
1 Z e e1 bp wM
13 m e2 vM
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 17.0 15.5 A2 4.6 4.2 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e 3.4 e1 1.7 e2 5.08 Eh 6 j 3.4 3.1 L 12.4 11.0 L3 2.4 1.6 m 4.3 Q 2.1 1.8 v 0.8 w 0.25 x 0.03 Z (1) 2.00 1.45
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT141-6 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-03-11
July 1994
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Philips Semiconductors
Product specification
24 W BTL or 2 x 12 watt stereo car radio power amplifier
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA1516BQ
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
July 1994
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